HIGH SPEED BURN-IN TEST APPARATUS

摘要

PURPOSE: A high speed burn-in test apparatus is provided to reduce the number of contact points of a connector connection by directly connecting a burn-in board and a control board on a feed through board; reduce the length of a connection pattern for connecting the burn-in board, the feed through board and the control board and prevent the distortion of a test signal when conducting a high speed test; thereby improving the reliability of the semiconductor parts and accurately conduct a function test with a simplified structure of the high speed burn-in test apparatus. CONSTITUTION: A burn-in board(10) in which multiple DUT(Device Under Test) are installed to be arranged on the upper side has a first rectangular connector. A feed through board(20) installed on one side of the burn-in board has a pair of second rectangular connectors(21). A control board(30) installed on one side of the feed through board has a third rectangular connector(31). The pair of second rectangular connectors installed respectively on one side and a different side of the feed through board are electrically connected to the burn-in board and the control board to each other through the feed through board by the connection with the first rectangular connector and the third rectangular connector.