| 摘要 |
Predicting simultaneous switching output noise of an IC device is described. User input is obtained. The user input includes: an identification of an input/output bank of an integrated circuit die; an identification of a device package substrate to which the integrated circuit die is to be attached; and an identification of input/output interface to be used by the input/output bank. A noise factor and an impedance are selected responsive to the user input. The noise factor is multiplied with the impedance to provide a result. The result, which is output, is a prediction of the simultaneous switching output noise of the integrated circuit device.
|
