METHOD FOR MANURACTURING PRINTED CIRCUIT BOARD WITH VIA AND FINE PITCH CIRCUIT AND PRINTED CIRCUIT BOARD BY THE SAME METHOD

摘要

PURPOSE: A method for manufacturing a printed circuit board capable of having a via and a micro-patterning circuit and the printed circuit board by the method are provided to use a prepreg with a material of an insulator layer, thereby manufacture a thin substrate in a coreless type without a core. CONSTITUTION: A substrate of an conducting material is prepared(S100). By corresponding to a pattern in which a via will be formed in one side of a substrate, the remaining area, except the via will be formed, is selectively performed a first etching(S200). By corresponding to a pattern in which a first micro-patterning circuit will be formed in one side of a first etching substrate, the area corresponding to a part in which the first micro-patterning circuit is insulated is selectively performed a second etching(S300). A first insulator layer is laminated in a space which is formed by the first etching and the second etching(S400). The first insulator layer is exposed to the outside by polishing the other side of the substrate(S500). [Reference numerals] (S100) Step of preparing a substrate of a conducting material; (S200) Step of selectively etching a remaining area except an area on which a via will be formed; (S210) Step of coating a first photosensitive resist layer; (S220) Step of exposing and developing the first photosensitive resist layer by corresponding to a pattern on which a via will be formed; (S230) Step of etching a substrate exposed to the outside through the first photosensitive resist layer; (S240) Step of removing the first photosensitive resist layer; (S300) Step of selectively etching an insulation area of a micro-patterning circuit; (S310) Step of coating a second photosensitive resist layer; (S320) Step of exposing and developing the second photosensitive resist layer by corresponding to a pattern on which a first micro-patterning circuit will be formed; (S330) Step of etching the substrate exposed to the outside through the second photosensitive resist layer; (S340) Step of removing the second photosensitive layer; (S400) Step of laminating a first insulator layer; (S500) Step of polishing the other surface of an unetched substrate; (S600) Step of performing surface protection