COMPRESSION MOLDING METHOD FOR ELECTRONIC COMPONENT AND COMPRESSION MOLDING APPARATUS EMPLOYED THEREFOR

摘要

FIRST, A HORIZONTAL NOZZLE (23) IS INSERTED BETWEEN AN UPPER MOLD SECTION (6) AND A LOWER MOLD SECTION (7) IN A HORIZONTALLY EXTENDING STATE. THEN, LIQUID RESIN (4) IS HORIZONTALLY DISCHARGED FROM A DISCHARGE PORT (29) OF THE HORIZONTAL NOZZLE (23). THUS, THE LIQUID RESIN (4) IS SUPPLIED INTO A CAVITY (10). THEREAFTER THE UPPER MOLD SECTION (6) AND THE LOWER MOLD SECTION (7) ARE CLOSED. CONSEQUENTLY, AN ELECTRONIC COMPONENT (2) MOUNTED ON A SUBSTRATE (1) IS DIPPED IN THE LIQUID RESIN (4) STORED IN THE CAVITY (10). THEREFORE, THE ELECTRONIC COMPONENT (2) IS RESIN-SEALED ON THE SUBSTRATE (1) BY COMPRESSION MOLDING.