| 摘要 |
<p>A method and apparatus for optical inspection of a defect on an integrated circuit. The method comprises: receiving a scattered light and a reflected light from the defect on the integrated circuit via a helical phase modulation system, where the scattered light forms a circularly-shaped image on an image-receiving plane via the helical phase modulation system, where the reflected light forms an identical-phase uniform background light on the image-receiving plane via a center of the helical phase modulation system, and where the circularly-shaped image and the identical-phase uniform background light generate a phase interference on the image-receiving plane, thereby forming a light spot image comprising a bright spot and a dark spot; and determining the type of the defect on the integrated circuit on the basis of the light spot image.</p> |
