发明名称 |
METHOD FOR FABRICATING A THREE-DIMENSIONAL INDUCTOR CARRIER WITH METAL CORE AND STRUCTURE THEREOF |
摘要 |
A method for fabricating a inductor carrier comprises the steps of providing a substrate with a protective layer; forming a first photoresist layer on protective layer; patterning the first photoresist layer to form a first opening and first apertures; forming a first metal layer within first opening and first apertures; removing the first photoresist layer; forming a first dielectric layer on protective layer; forming a second photoresist layer on first dielectric layer; patterning the second photoresist layer to form a second aperture and a plurality of third apertures; forming a second metal layer within second aperture and third apertures; removing the second photoresist layer; forming a second dielectric layer on first dielectric layer; forming a third photoresist layer on second dielectric layer; patterning the third photoresist layer to form a fifth aperture and sixth apertures; forming a third metal layer within fifth aperture and sixth apertures.
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申请公布号 |
US2013075860(A1) |
申请公布日期 |
2013.03.28 |
申请号 |
US201113247076 |
申请日期 |
2011.09.28 |
申请人 |
KUO CHIH-MING;HSU YOU-MING;CHIPBOND TECHNOLOGY CORPORATION |
发明人 |
KUO CHIH-MING;HSU YOU-MING |
分类号 |
H01L23/48;H01L21/02 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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