| 摘要 |
<P>PROBLEM TO BE SOLVED: To equalize the speed of sputtering a cylindrical sputtering target material from an outer peripheral surface from an inner peripheral surface thereof. <P>SOLUTION: The cylindrical sputtering target material 20 has a cylindrical shape, and is formed from oxygen-free copper having a purity of 3N level or higher. The hardness of the target material gradually increases from the outer peripheral surface 21 to the inner peripheral surface 22, and the orientation rate of a (111) surface gradually increases from the outer peripheral surface 21 to the inner peripheral surface 22. <P>COPYRIGHT: (C)2013,JPO&INPIT |
