摘要 |
<p>The invention relates to a chemical-mechanical polishing composition comprising silica, one or more organic carboxylic acids or salts thereof, one or more polysaccharides, one or more bases, optionally one or more surfactants and/or polymers, optionally one or more reducing agents, optionally one or more biocides, and water, wherein the polishing composition has an alkaline pH. The polishing composition exhibits a high removal rate and low particle defects and low haze. The invention further relates to a method of chemically-mechanically polishing a substrate using the polishing composition described herein.</p> |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
WHITE, MICHAEL;ROMINE, RICHARD;REISS, BRIAN;GILLILAND, JEFFREY;JONES, LAMON |