发明名称 |
CURABLE SILICONE COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR ELEMENT, METHOD OF PRODUCING A RESIN-SEALED OPTICAL SEMICONDUCTOR ELEMENT, AND RESIN-SEALED OPTICAL SEMICONDUCTOR ELEMENT |
摘要 |
A curable silicone composition for sealing an optical semiconductor element, comprising: (A) an organopolysiloxane that has at least two silicon-bonded vinyl groups in one molecule, that has C1-10 alkyl for the other silicon-bonded organic groups therein, and that lacks a siloxane unit represented by the following formula: SiO4/2; (B) an organopolysiloxane represented by an average unit formula; (C) an organopolysiloxane that has at least three silicon-bonded hydrogen atoms in one molecule, that has C1-10 alkyl for the silicon-bonded organic groups therein, and that contains from 0.7 to 1.6 mass% of silicon-bonded hydrogen atoms; and (D) a hydrosilylation reaction catalyst, wherein a viscosity at 25 °C and a viscosity at 100 °C of this composition lacking component (D) reside in a specific relationship, can efficiently perform resin sealing by transfer molding or compression molding while exhibiting an excellent moldability and can provide a cured product that has a low surface tack. |
申请公布号 |
WO2013042794(A1) |
申请公布日期 |
2013.03.28 |
申请号 |
WO2012JP74601 |
申请日期 |
2012.09.18 |
申请人 |
DOW CORNING TORAY CO., LTD.;MIYAMOTO, YUSUKE;YOSHITAKE, MAKOTO |
发明人 |
MIYAMOTO, YUSUKE;YOSHITAKE, MAKOTO |
分类号 |
C08L83/04 |
主分类号 |
C08L83/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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