发明名称
摘要 <p>An excellent low temperature heat sealing property is imparted to a surface of a non-perfluoro fluorine-containing resin molded article having F/C of not more than 1.8. A non-perfluoro fluorine-containing resin molded article having a surface layer portion having a low temperature heat sealing property on at least a part of the surface layer thereof; said surface layer portion having a low temperature heat-sealing property has a ratio F/C of the number of fluorine atoms to the number of carbon atoms of 0.2&lt;/=F/C&lt;/=0.9 and a ratio O/C of the number of oxygen atoms to the number of carbon atoms of 0.09&lt;/=O/C&lt;/=0.40, and a remaining portion of the surface layer has a ratio F/C of the number of fluorine atoms to the number of carbon atoms which is larger than that of the surface layer portion having a low temperature heat-sealing property and is 0.8&lt;/=F/C&lt;/=1.8. &lt;IMAGE&gt;</p>
申请公布号 JP5170919(B2) 申请公布日期 2013.03.27
申请号 JP20000574596 申请日期 1999.10.01
申请人 发明人
分类号 C08J5/00;B32B7/10;B32B27/08;C08J7/12;H01M2/02 主分类号 C08J5/00
代理机构 代理人
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