| 摘要 |
PURPOSE: A control system of a wafer polishing apparatus and a polishing method using the same are provided to secure uniform patterns by controlling the shape of a metal plate. CONSTITUTION: A metal plate(300) is arranged on a base plate(200). A pattern is formed in the metal plate. A pattern processing part(400) is arranged on the metal plate. A control part controls the movement of the pattern processing part. A three shaft driving part(500) operates the pattern processing part. |
