发明名称 |
Integrated circuit system with via and method of manufacture thereof |
摘要 |
A method of manufacture of an integrated circuit system includes: forming an etch stop layer over a bulk substrate; forming a buffer layer on the etch stop layer; forming a hard mask on the buffer layer; forming a through silicon via through the etch stop layer with the hard mask detected and the buffer layer removed with a low down force; and forming a passivation layer on the through silicon via and the etch stop layer. |
申请公布号 |
US8405222(B2) |
申请公布日期 |
2013.03.26 |
申请号 |
US20100825266 |
申请日期 |
2010.06.28 |
申请人 |
YU HONG;LIU HUANG;ZHAO FENG;ZHOU MEISHENG;HSIA LIANG-CHOO;GLOBALFOUNDRIES SINGAPORE PTE. LTD. |
发明人 |
YU HONG;LIU HUANG;ZHAO FENG;ZHOU MEISHENG;HSIA LIANG-CHOO |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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