DIE BONDER AND DIE BONDING METHOD

摘要

PURPOSE: A die bonder and a die bonding method are provided to reduce the number of handling and improve yield. CONSTITUTION: A die supply stage(2) supports a wafer. A first head includes a first collet(5) for temporarily attaching a die on an attach stage(4). A second head includes a second collet(55) for temporarily pressing the die on an attach stage.