| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide solder powder which is fine solder powder suitable for solder paste achieving a fine pitch, has excellent meltability and diffusibility during reflow, in which compositional control during the formation of a solder bump is facilitated, and which is excellent in wettability, and to provide the solder paste using the powder. <P>SOLUTION: A particle of the solder powder 10 is configured of a core 11 and a coating layer 13 applied on the core 11, and has an average particle diameter of 5 μm or smaller. The core 11 is configured of an intermetallic compound of silver and tin, the coating layer 13 is formed of tin; and an intermediate layer 12 configured of an intermetallic compound of copper and tin lies between the core 11 and the coating layer 13 to cover at least a part of the core 11. <P>COPYRIGHT: (C)2013,JPO&INPIT |
