发明名称 JUNCTION COMPOSITION, JUNCTION STRUCTURE, AND METHOD OF MANUFACTURING JUNCTION STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a junction composition and a junction structure, capable of enhancing junction reliability of first and second junction object members after junction, and controlling with high precision an interval between the first and second object junction members. <P>SOLUTION: The junction composition is used for jointing first and second junction object members 2, 3, and 4. The junction composition contains a junction material containing metal atom containing particles and conductive particles 21 of which CV value of particle size is 10% or less. A junction structure 1 includes the first junction object member 2, the second junction object members 3 and 4, and junction parts 5 and 6 jointing the first and second junction object members 2, 3, and 4. The junction parts 5 and 6 are formed by heating the junction composition so that the metal atom containing particles are sintered. The conductive particle 21 is arranged among the first and second junction object members 2, 3, and 4. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013055046(A) 申请公布日期 2013.03.21
申请号 JP20120173069 申请日期 2012.08.03
申请人 SEKISUI CHEM CO LTD 发明人 UENOYAMA SHINYA
分类号 H01B1/22;B22F1/00;H01B1/00;H01L21/52;H05K3/32;H05K3/34 主分类号 H01B1/22
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