| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a cleaner composition which, when used to clean an electronic component mounted with lead-containing high melting point solder, can suppress a phenomenon of elution of an insoluble lead compound in rinsing water during water rinse and has cleaning performance comparable to that of using a rinse agent. <P>SOLUTION: The cleaner composition for soldering flux contains (A) a water-insoluble polycarboxylic acid compound represented by general formula (1) (wherein R<SP POS="POST">1</SP>denotes 8-72C linear or branched chain unsaturated or saturated alkyl or alkylene, and n denotes 2-4), (B) a phosphoric acid ester surfactant, and (C) an organic solvent. <P>COPYRIGHT: (C)2013,JPO&INPIT |
