发明名称 |
FLOW BOILING HEAT SINK WITH VAPOR VENTING AND CONDENSING |
摘要 |
A method is provided for facilitating extraction of heat from a heat-generating electronic component. The method includes providing a heat sink, the heat sink including a thermally conductive structure which has one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s).
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申请公布号 |
US2013070420(A1) |
申请公布日期 |
2013.03.21 |
申请号 |
US201213676227 |
申请日期 |
2012.11.14 |
申请人 |
MACHINES CORPORATION INTERNATIONAL BUSINESS;INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
CAMPBELL LEVI A.;CHU RICHARD C.;DAVID MILNES P.;ELLSWORTH, JR. MICHAEL J.;IYENGAR MADHUSUDAN K.;SIMONS ROBERT E. |
分类号 |
H02K7/20 |
主分类号 |
H02K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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