| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor apparatus which can facilitate checking of the quality of bonding of metal connection boards through a bonding material, and to provide a method of manufacturing the same. <P>SOLUTION: A semiconductor apparatus 10 principally includes a semiconductor device 12, an island 14 for mounting the semiconductor device 12, a lead 20 electrically connected with the semiconductor device 12 through a metal connection board 16, and a resin 38 for sealing the semiconductor device 12. A recess 28 is provided at the end of the metal connection board 16 and the quality of connection can be determined by confirming existence of a bonding material 31 exposed from the recess 28. <P>COPYRIGHT: (C)2009,JPO&INPIT |
