| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly-reliable semiconductor device capable of suppressing occurrence of crack and peeling of a sealing material, and a manufacturing method thereof. <P>SOLUTION: A semiconductor device 110 is provided that comprises a base plate 10, a mounting substrate 30, a semiconductor element 50, a holder 20, a holder terminal 21, a case 90, a first sealing layer 71, and a second sealing layer 72. The mounting substrate 30 is provided on the base plate 10. The semiconductor element 50 is provided on the mounting substrate 30. The holder 20 is provided above the mounting substrate 30. The holder terminal 21 is retained on the holder 20 and electrically connected to the semiconductor element 50. The case 90 surrounds the mounting substrate 30 along a side surface of the mounting substrate 30, and surrounds the holder 20 along a side surface of the holder 20. The first sealing layer 71 covers the mounting substrate 30 and the semiconductor element 50 in the space surrounded by the case 90. <P>COPYRIGHT: (C)2013,JPO&INPIT |
