| 摘要 |
<P>PROBLEM TO BE SOLVED: To inhibit an adhesive layer from being removed from an adhesive tape when a peeling film is peeled from a tape for wafer processing. <P>SOLUTION: In a tape for wafer processing 1, tackiness agent layers 5, 6 and an adhesive layer 3 are formed on a base film 7. A peripheral part on the adhesive layer 3 is covered by the tackiness agent layer 6. <P>COPYRIGHT: (C)2013,JPO&INPIT |
