| 摘要 |
<p>Provided are an electroconductive material having excellent heat resistance and ensuring that a first metal and a second metal have good diffusivity in a soldering step when the material is used, for example, as a solder paste, that a high-melting intermetallic compound is formed at a low temperature and in a short time, and that the first metal leaves substantially no residue after soldering. Also provided are a connection method and connection structure using the material and having high connection reliability. A configuration is adopted comprising a metal component containing a first metal and a second metal having a higher melting point than the first metal, the configuration being provided with a requirement that the first metal be Sn or an alloy comprising Sn, and the second metal be a Cu-Cr alloy that forms with the first metal an intermetallic compound exhibiting a melting point of 310°C or above. The first metal can be Sn alone or an alloy comprising Sn and at least one of Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Pd, Si, Sr, Te, and P.</p> |
