发明名称 METHOD FOR FABRICATING A FINFET DEVICE
摘要 A FinFET device and method for fabricating a FinFET device is disclosed. An exemplary method includes forming a fin structure on a semiconductor substrate and forming a gate structure on the fin structure. A capping layer is then formed over the semiconductor substrate, fin structure, and gate structure. The capping layer is patterned to form an opening exposing a second portion of the fin structure. An epitaxial layer is grown in the opening and on the second portion of the fin structure. At least one of a source region and a drain region is provided in the epitaxial layer. The method may continue to remove the capping layer.
申请公布号 US2013071980(A1) 申请公布日期 2013.03.21
申请号 US201213673406 申请日期 2012.11.09
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIN HSIEN-HSIN;KWOK TSZ-MEI;SU CHIEN-CHANG
分类号 H01L21/336 主分类号 H01L21/336
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