ISLANDLESS PRE-ENCAPSULATED ETCHING-THEN-PLATING LEAD FRAME STRUCTURES AND MANUFACTURING METHOD

摘要

A method for manufacturing an islandless lead frame structure (100) for semiconductor packaging includes providing a metal substrate, and performing an etching process on the top surface and the back surface of the metal substrate simultaneously using a top surface etching pattern and a back surface etching pattern as the respective masks to form etched regions in the metal substrate and a plurality of leads (2), without forming an island. Further, the method includes placing the etched metal substrate in a mold, and encapsulating the etched metal substrate using the mold such that a molding compound (4) is filled in the etched regions and areas between the plurality of leads (2), while exposing top surfaces and back surfaces of the plurality of leads (2). The method also includes performing a plating process on the encapsulated metal substrate to form a first metal layer (5) on the exposed top surfaces of the plurality of leads (2), and a second metal layer (6) on the exposed back surfaces of the plurality of leads (2).