发明名称 |
SEMICONDUCTOR PACKAGE INCLUDING THROUGH-HOLE ELECTRODE AND LIGHT-TRANSMITTING SUBSTRATE |
摘要 |
An imaging element is formed on the first main surface of a semiconductor substrate. An external terminal is formed on the second main surface of the semiconductor substrate. A through-hole electrode is formed in a through hole formed in the semiconductor substrate. A first electrode pad is formed on the through-hole electrode in the first main surface. An interlayer insulating film is formed on the first electrode pad and on the first main surface. A second electrode pad is formed on the interlayer insulating film. A passivation film is formed on the second electrode pad and the interlayer insulating film, and has an opening which exposes a portion of the second electrode pad. A contact plug is formed between the first and second electrode pads in a region which does not overlap the opening when viewed in a direction perpendicular to the surface of the semiconductor substrate. |
申请公布号 |
EP2179444(A4) |
申请公布日期 |
2013.03.20 |
申请号 |
EP20080868487 |
申请日期 |
2008.12.19 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KAWASAKI, ATSUKO;MATSUO, MIE;INOUE, IKUKO;AYABE, MASAYUKI;SEKIGUCHI, MASAHIRO;TANIDA, KAZUMASA |
分类号 |
H01L27/14;H01L21/3205;H01L21/768;H01L23/48;H01L23/52;H01L23/522;H01L27/146;H04N5/225;H04N5/335;H04N5/369 |
主分类号 |
H01L27/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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