发明名称 LIGHT EMITTING DIODE PACKAGE
摘要 <p>PURPOSE: A light emitting diode package is provided to increase the quantity of light which is emitted to the outside by using a PSS(Patterned Sapphire Substrate). CONSTITUTION: A PCB substrate(300) includes a wall(320). The wall is formed on a body part(310). A lens(400) is arranged on the wall. A light emitting diode chip(200) is formed on the body part. A hallow part defines a light orientation angle.</p>
申请公布号 KR20130028367(A) 申请公布日期 2013.03.19
申请号 KR20110091869 申请日期 2011.09.09
申请人 SEOUL OPTO DEVICE CO., LTD. 发明人 PARK, JUN YONG;SUH, DAE WOONG;JUNG, HEE CHEUL;JANG, BO RAM I
分类号 H01L33/48;H01L33/58 主分类号 H01L33/48
代理机构 代理人
主权项
地址