<p>PURPOSE: A light emitting diode package is provided to increase the quantity of light which is emitted to the outside by using a PSS(Patterned Sapphire Substrate). CONSTITUTION: A PCB substrate(300) includes a wall(320). The wall is formed on a body part(310). A lens(400) is arranged on the wall. A light emitting diode chip(200) is formed on the body part. A hallow part defines a light orientation angle.</p>
申请公布号
KR20130028367(A)
申请公布日期
2013.03.19
申请号
KR20110091869
申请日期
2011.09.09
申请人
SEOUL OPTO DEVICE CO., LTD.
发明人
PARK, JUN YONG;SUH, DAE WOONG;JUNG, HEE CHEUL;JANG, BO RAM I