发明名称 Substrate for suspension
摘要 A substrate for suspension comprises a metallic substrate, an insulating layer formed on the metallic substrate, having an opening for grounding terminal, and a grounding conductor formed on the insulating layer. A grounding-terminal-forming material is placed in the opening for grounding terminal to form a grounding terminal that connects the metallic substrate and the grounding conductor. The grounding conductor does not surround a portion of the circumference of the opening for grounding terminal.
申请公布号 US8399774(B2) 申请公布日期 2013.03.19
申请号 US201113303769 申请日期 2011.11.23
申请人 HITOMI YOICHI;MIYAZAWA HIROAKI;KUMON SHINJI;MOMOSE TERUTOSHI;DAI NIPPON PRINTING CO., LTD. 发明人 HITOMI YOICHI;MIYAZAWA HIROAKI;KUMON SHINJI;MOMOSE TERUTOSHI
分类号 H05K1/00;H05K1/02 主分类号 H05K1/00
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