| 摘要 |
<p>PURPOSE: A stacked semiconductor package and a method for fabricating the same are provided to reduce the size by using a silicon through via and wafer bonding. CONSTITUTION: A MEMS device(120) is formed in a first wafer(100). A readout integrated circuit device is formed in a second wafer. A first penetration electrode passes through the first wafer. A second penetration electrode passes through the second wafer.</p> |
