SEMICONDUCTOR PACKAGE HAVING SUPPORTING MEMBER INCLUDING PASSIVE ELEMENT

摘要

PURPOSE: A semiconductor package including a support member with a passive device is provided to improve the integration of the semiconductor package by overlapping a second semiconductor chip with a first semiconductor chip by interposing the support member with an adjustable size under the first semiconductor chip. CONSTITUTION: A plurality of first semiconductor chips(140) are laminated on a substrate(110). The first semiconductor chip is electrically connected to the substrate through first connection members(145). A second semiconductor chip is located between the substrate and the lowermost first semiconductor chip. The second semiconductor chip is attached to the substrate by an adhesive member(152). A support member(130) is interposed between the substrate and the lowermost first semiconductor chip to support the plurality of first semiconductor chips. The support member includes a passive device.