| 发明名称 |
PRINTED CIRCUIT BOARD INCLUDING UNDER-FILL DAM AND FABRICATION METHOD THEREOF |
| 摘要 |
The present invention relates to an under-fill dam with high detection probability that is composed of a dry film solder resist and provided in the form of a fence around a chip device in order to prevent leaks of an under-fill material filled in a gap between a substrate and the chip device. |
| 申请公布号 |
US2013063917(A1) |
申请公布日期 |
2013.03.14 |
| 申请号 |
US201113699275 |
申请日期 |
2011.05.11 |
| 申请人 |
CHOI BYUNG-JU;JEONG WOO-JAE;CHOI BO-YUN;LEE KWANG-JOO;JEONG MIN-SU;LG CHEM, LTD. |
发明人 |
CHOI BYUNG-JU;JEONG WOO-JAE;CHOI BO-YUN;LEE KWANG-JOO;JEONG MIN-SU |
| 分类号 |
H05K7/00;H01L21/56;H05K7/02 |
主分类号 |
H05K7/00 |
| 代理机构 |
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