WIRE BONDING SYSTEM FOR SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A wire bonding system of a semiconductor package is provided to minimize a loop height of a wire by removing the electrical physical deformation section of the wire due to an electric shock of a torch tip to maintain the flexibility of the wire. CONSTITUTION: A wire supply unit(100) supplies a wire to a ball forming position and includes a spool(1), a wire tension unit(2), a wire clamp(3), a transducer(4), and a capillary(5). The wire tension unit improves the bonding of the wire by applying fine vibration energy to the wire. A laser beam output unit(10) outputs at least one carbon dioxide laser beam. A laser beam guide unit(20) guides laser beams from the laser beam output unit to the ball forming position and includes an optical fiber line(21) which is extended from the laser beam output unit.