| 摘要 |
A Sn-Ag-Cu-Bi lead-free solder which can be used for soldering of vehicle-mounted electronic circuits and which has excellent resistance to heat cycles and mechanical strength is provided. The solder consists essentially of Ag: 2.8 - 4 mass %, Bi: 1.5 - 6 mass %, Cu: 0.8 - 1.2 mass %, and a remainder of Sn. |
