| 摘要 |
PURPOSE: A mounting structure is provided to reduce acoustic noise by using one electronic component including a condenser. CONSTITUTION: An electronic component(10) is mounted on a circuit board(50). A land(54a,54b) is formed on a substrate(52). An outer electrode(12a,12b) is connected to a solder(60a,60b). The height(H1) between the solder and the land is 1.27 times lower than the height(H2) of a condenser conductor(32d). |
