| 摘要 |
PURPOSE: A PCB bonding device and a PCB bonding method are provided to reduce working hours and improve productivity by arranging the PCB, at which an anisotropic conductive film is attached, at left and right sides and improving the flow of distribution and working methods. CONSTITUTION: A PCB supplying device(30) supplies a PCB. Anisotropic conductive film bonding devices(41,42) are formed at one side or both sides of the PCB supplying device for attaching an anisotropic conductive film to the PCB supplied by the PCB supplying device. Aligning devices(51,52) align the PCB to which the anisotropic conductive film is attached and a panel to which a tab IC, which is supplied by a panel supplying device, is attached. A panel supplying device(60) comprises a panel supplying handler(61) transferring a transferred panel to a stage(63). A main bonding device(70) mainly bonds the aligned PCB and the panel. A discharging handler(80) discharges the panel to which the PCB is attached and transfers to a next process.
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