| 摘要 |
PURPOSE: A conductive complex is provided to ensure high conductivity and heat dissipation property, and to enable use as a heat dissipation pad for LED light, film and sheet for EMI shielding, conductive paste for PCB, and heat dissipation and electronic wave shielding materials of electronic components. CONSTITUTION: A conductive complex includes: low-melting-point alloy filler; a polymer matrix in which the hardening is uncompleted at a melting point of the low-melting-point alloy filler; and a polysiloxane-metal oxide complex which is mixed with the polymer matrix and used instead of a polymer matrix and forms an oxidized metal group by being bonded with metal oxides. |
