| 摘要 |
Provided are a circuit module and a composite circuit module, which are capable of suppressing breakage of connection inside of apparatuses when heat is applied. A SAW filter (32) includes a piezoelectric substrate. A package substrate (30), i.e., a resin substrate, has the SAW filter (32) mounted thereon. A mounting substrate is a multilayer substrate mounted on a mother substrate, and has the package substrate (30) mounted thereon. |
