发明名称 |
A FABRICATION OF NITRIDE SEMICONDUCTOR |
摘要 |
<p>PURPOSE: A method for manufacturing a nitride semiconductor device is provided to control a threshold voltage or a breakdown voltage by controlling the thickness and density of a low density n-type GaN layer and a p-type GaN layer. CONSTITUTION: A high density n-type GaN layer(20), a low density n-type GaN layer(30), a p-type GaN layer(40), and an n-type GaN layer(50) are successively formed on a substrate(10). A 3D structure vertically protruding from the surface of the substrate is formed by vertically etching a part of the n-type GaN layer, the p-type GaN layer, and the low density GaN layer. The upper side of the high density n-type GaN layer is exposed by etching a part of the low density n-type GaN layer. An oxide layer(60) is deposited to surround the 3D structure. A source contact(70) in contact with the upper side of the n-type GaN layer and a drain contact(80) in contact with the high density n-type GaN layer are formed.</p> |
申请公布号 |
KR20130022971(A) |
申请公布日期 |
2013.03.07 |
申请号 |
KR20110086050 |
申请日期 |
2011.08.26 |
申请人 |
KYUNGPOOK NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION |
发明人 |
LEE, JUNG HEE;IM, KI SIK;KIM, KI WON;KIM, DONG SEOK;KANG, HEE SUNG;KIM, RYUN HWI |
分类号 |
H01L21/336;H01L29/78 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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