发明名称 MULTILAYER CHIP CAPACITOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a multilayer chip capacitor. <P>SOLUTION: In a multilayer chip capacitor, a plurality of internal electrodes which are arranged successively in a lamination direction constitutes one block. The blocks are stacked repeatedly, an average number of leads in each internal electrode is smaller than half of a total number of external electrodes. The leads of the internal electrodes having opposite polarities and (vertically) adjacent in the lamination direction are disposed so as to be adjacent to each other from the point of view of the lamination direction at all times. All the internal electrodes having the same polarity are electrically connected by the external electrodes. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013048299(A) 申请公布日期 2013.03.07
申请号 JP20120264393 申请日期 2012.12.03
申请人 SAMSUNG ELECTRO-MECHANICS CO LTD 发明人 LEE BYOUNG HWA;WI SUNG KWON;CHUNG HAE SUK;PARK DON-SEOK;PARK SANG SOO;PARK MIN CHEOL
分类号 H01G4/30;H01G4/232 主分类号 H01G4/30
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