| 发明名称 |
COPPER ALLOY FOR ELECTRONIC DEVICE, METHOD OF PRODUCING COPPER ALLOY FOR ELECTRONIC DEVICE, AND COPPER ALLOY ROLLED MATERIAL FOR ELECTRONIC DEVICE |
| 摘要 |
A copper alloy for an electronic device containing Mg in a range of 2.6 atomic % or more and 9.8 atomic % or less, Al in a range of 0.1 atomic % or more and 20 atomic % or less, and the balance substantially consisting of Cu and unavoidable impurities. |
| 申请公布号 |
US2013056116(A1) |
申请公布日期 |
2013.03.07 |
| 申请号 |
US201113697441 |
申请日期 |
2011.05.12 |
| 申请人 |
ITO YUKI;MAKI KAZUNARI;MITSUBISHI MATERIALS CORPORATION |
发明人 |
ITO YUKI;MAKI KAZUNARI |
| 分类号 |
C22C9/01;C22F1/08;H01B1/02 |
主分类号 |
C22C9/01 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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