ETCHANT LIQUID COMPOSITION FOR A METAL LAYER, INCLUDING COPPER AND TITANIUM
摘要
<p>The present invention relates to an etchant liquid composition for a metal layer, the composition comprising: persulfate; a fluorine-containing compound; an inorganic acid; a ring-type amine compound; a compound containing chlorine; phosphate; and water. More particularly, the present invention relates to an etchant liquid composition for a metal layer, the composition comprising copper and titanium.</p>
