发明名称 FLEXIBLE CIRCUIT BOARD AND ITS METHOD FOR PRODUCTION
摘要 A flexible circuit board and a method for production thereof in which in cases where elastic wiring in movable parts is required, the wiring can be made to expand and contract with a simple arrangement, and the circuit board is excellent in weight and size reduction, and breaking or disconnection and exfoliation of a wiring layer do not take place easily, even in cases where the circuit board is deformed in a repeated manner. The flexible circuit board which has an insulating film made of a thermoplastic resin, a wiring layer formed on the insulating film, and an insulating layer made of a thermoplastic resin and formed on the wiring layer. A spiral part shaped into a spiral shape is provided in at least a part of the flexible circuit board, and the flexible circuit board is constructed to be expandable and contractable, and/or torsionally deformable in the spiral part.
申请公布号 US2013056248(A1) 申请公布日期 2013.03.07
申请号 US201013641769 申请日期 2010.12.24
申请人 KAJIYA ATSUSHI;YOSHIHARA HIDEKAZU;NIPPON MEKTRON, LTD. 发明人 KAJIYA ATSUSHI;YOSHIHARA HIDEKAZU
分类号 H05K1/00;H05K3/00 主分类号 H05K1/00
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