MECHANICAL ATTACHMENT OF THERMALLY STABLE DIAMOND TO A SUBSTRATE
摘要
The present disclosure provides mechanical attachments of TSD body to a carrier or substrate sufficient to allow eventual conventional attachment of the TSD to a drill bit or other component. According to one aspect, the disclosure includes a composite assembly including a thermally stable diamond (TSD) body and a substrate with aligned holes and a joining pin located in the aligned holes to mechanically attach the TSD body and substrate. The composite assembly may lack any non-mechanical attachment between the TSD body and the substrate, or may lack particular types of non-mechanical attachments. The disclosure also provides drill bits and other devices containing such composite assemblies as well as methods of making such composite assemblies and drill bits or other devices.
申请公布号
WO2013033187(A2)
申请公布日期
2013.03.07
申请号
WO2012US52830
申请日期
2012.08.29
申请人
HALLIBURTON ENERGY SERVICES, INC.;WEAVER, GARY E.;ANDERLE, SETH G.;LADI, RAM L.