摘要 |
<p>A radio frequency (RF) circuit (e.g., 100, 200) is configured for impedance matching, such as for mitigating noise. In connection with an example embodiment, an RF circuit (e.g., 100) includes a transceiver (e.g., 200) in a substrate, and a conductive ring-type of material ( e.g ., 242, 244) in the substrate and around at least a portion of the transceiver circuit. An upper conductive ring material (e.g., 160, 260, 262) is over the substrate and separated from the conductive ring-type material by an insulating layer. The upper conductive ring material is configured to generate an inductance that matches input impedance characteristics of the transceiver circuit. In some implementations, the upper conductive ring material connects a gate input pin (e.g., 605) of the circuit with the gate ( e.g ., 630) of an input transistor of an amplifier in the transceiver, and exhibits an impedance that matches the impedance of the input transistor.</p> |