发明名称 METHOD OF REMOVING MEMS DEVICES FROM A HANDLE SUBSTRATE
摘要 <p>A device for removing MEMS devices ( 2 ) from a handle substrate ( 1 ), where the MEMS devices are individually bonded to it via a thermal release adhesive ( 3 ) that reduces its adhesion when heated above a threshold temperature. The MEMS devices ( 2 ) are individually heated ( 16 ) to conductively heat the thermal release adhesive ( 11 ) above the threshold temperature. With the adhesive ( 11 ) directly in contact with the back side ( 5 ) of the MEMS device ( 2 ) no longer bonding it to the glass handle ( 1 ), the devices ( 2 ) can be individually removed by a die picker ( 6 ). This quickly heats the adhesive to release each die in about 1 second. This is comparable to UV release adhesive and does not require a prior 30 minute drying bake. Furthermore, by heating the die to conductively heat the adhesive, only that adhesive which is closely localized to the die is heated. The adhesive that bonds the adjacent dies to the glass handle remains unaffected.</p>
申请公布号 EP2146924(B1) 申请公布日期 2013.03.06
申请号 EP20080733447 申请日期 2008.05.06
申请人 SILVERBROOK RESEARCH PTY. LTD 发明人 PAPWORTH, PAUL, ANDREW;THELANDER, JASON, MARK;FOOTE, ROGER, MERVYN, LLOYD;VELLA, ANDREW, LEON;JOHNSTONE, DAVID, MCLEOD;SILVERBROOK, KIA
分类号 H01L21/683;H01L21/67 主分类号 H01L21/683
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