| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of sealing semiconductor components in which a resin sheet is high in general-purposeness, end faces of produced packages have a fixed shape and size reduction of a device is enabled, and also to provide a method for manufacturing semiconductor device that allows cost reduction and quality improvement. SOLUTION: The method of manufacturing a semiconductor device includes: a step of preparing a circuit board 10, on which a plurality of semiconductor chips 11 are mounted; a step of filling a sealing resin layer 3 of a resin sheet for sealing the semiconductor 1 into each gap formed between a protrusion and a recess of the semiconductor chip mounted face of the circuit board, to bring the face of the sealing resin layer into contact with the face of the circuit board, while keeping a configuration such that the resin sheet for sealing the semiconductor 1 is attached to bridge across a frame 4, that has an opening that is slightly larger than the planar shape of the circuit board; and a step of cutting the circuit board, together with the sealing resin layer in units of semiconductor chips. The method includes a step of thermally curing the sealing resin layer, after the step of bringing the face of the sealing resin layer into contact with the face of the circuit board, or the like. COPYRIGHT: (C)2010,JPO&INPIT |
