发明名称 Semiconductor device and method of manufacturing the same
摘要 A semiconductor device has a first-conductivity-type-channel MOSFET formed on a semiconductor substrate, wherein the first-conductivity-type-channel MOSFET is typically a P-channel MOSFET, and is composed of a gate insulating film and a gate electrode provided over the semiconductor substrate, the gate electrode contains a metal gate electrode provided over the gate insulating film, a metal oxide film provided over the metal gate electrode, and another metal gate electrode provided over metal oxide film.
申请公布号 US8390050(B2) 申请公布日期 2013.03.05
申请号 US20100823574 申请日期 2010.06.25
申请人 HIRAI TOMOHIRO;RENESAS ELECTRONICS CORPORATION 发明人 HIRAI TOMOHIRO
分类号 H01L29/788;H01L21/28;H01L21/336;H01L29/423 主分类号 H01L29/788
代理机构 代理人
主权项
地址