发明名称 Method of managing substrate
摘要 The electrostatic chuck is made up of: a chuck main body having electrodes; a chuck plate of a dielectric material and having a rib portion with which a peripheral edge portion of the substrate is capable of coming into surface contact, and a plurality of supporting portions which are vertically disposed at a predetermined distance from one another in an inner space enclosed by the rib portion; and a gas introduction means for introducing a predetermined gas into the inner space. When the substrate is held by the electrostatic chuck which is arranged to attract the substrate by the chuck plate and to form a gas atmosphere by supplying a predetermined gas into the inner space, a current value is monitored by causing an AC current to flow in a capacitance of the chuck plate through an AC power supply, a gas flow amount is monitored by causing the gas to flow through the gas introduction means, and a substrate state is managed based on a variation in at least one of the current value and the gas flow amount to prevent damages to the substrate.
申请公布号 US8389411(B2) 申请公布日期 2013.03.05
申请号 US200913119985 申请日期 2009.10.05
申请人 ISHIDA MASAHIKO;MORIMOTO NAOKI;SOKABE KOUJI;ULVAC, INC. 发明人 ISHIDA MASAHIKO;MORIMOTO NAOKI;SOKABE KOUJI
分类号 H01L21/311 主分类号 H01L21/311
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