发明名称 RESIST PATTERN FORMING METHOD, RESIST PATTERN, POSITIVE RESIST COMPOSITION, NANOIMPRINT MOLD AND PHOTOMASK
摘要 PURPOSE: A method for forming a resist, the resist pattern, a positive resist composition, a nanoimprint mold, and a photomask are provided to reduce defect generation due to scum. CONSTITUTION: A method for forming a resist pattern comprises: a step of forming a film on a substrate using a positive resist composition; a step of exposing the film with light; and a step of a developing the film using an alkaline developing solution. The thickness of the film is 15-40 nm. The alkaline developing solution contains 0.5-1.1 mass% of alkaline.
申请公布号 KR20130021324(A) 申请公布日期 2013.03.05
申请号 KR20120083655 申请日期 2012.07.31
申请人 FUJIFILM CORPORATION 发明人 TSUCHIHASHI TORU;SHIBATA MICHIHIRO
分类号 G03F7/26;G03F1/22;G03F7/004;G03F7/20 主分类号 G03F7/26
代理机构 代理人
主权项
地址