发明名称 |
Semiconductor device and manufacturing method thereof |
摘要 |
There are constituted by a tab on which a semiconductor chip is mounted, a sealing portion formed by resin-sealing the semiconductor chip, a plurality of leads each having a mounted surface exposed to a peripheral portion of a rear surface of the sealing portion and a sealing-portion forming surface disposed on an opposite side thereto, and a wire for connecting a pad of the semiconductor chip and a lead, wherein the length between inner ends of the sealing-portion forming surfaces of the leads disposed so as to oppose to each other is formed to be larger than the length between inner ends of the mounted surfaces. Thereby, a chip mounting region surrounded by the inner end of the sealing-portion forming surface of each lead can be expanded and the size of the mountable chip is increased.
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申请公布号 |
US8390133(B2) |
申请公布日期 |
2013.03.05 |
申请号 |
US201213534078 |
申请日期 |
2012.06.27 |
申请人 |
SHIMANUKI YOSHIHIKO;SUZUKI YOSHIHIRO;TSUCHIYA KOJI;RENESAS ELECTRONICS CORPORATION |
发明人 |
SHIMANUKI YOSHIHIKO;SUZUKI YOSHIHIRO;TSUCHIYA KOJI |
分类号 |
H01L23/48;H01L21/56;H01L23/31;H01L23/495;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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