| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an element package which allows for reduction of a space occupied by wiring, and to provide the element package. <P>SOLUTION: The manufacturing method of an element package 1 includes the steps of: preparing a substrate 10 along with a light emitting element 20; mounting the light emitting element 20 on a base 11; and forming the connection wiring 50 connecting first wiring 25 and second wiring 15 electrically by screen printing. The spacing between a plane including the second face 22b of the light emitting element 20 mounted on the base 11 and a plane including the end face 12a thereof is 10 μm or less. The connection wiring 50 is formed so as to cover the contact part of the edge of the second face 22b and the wall 12 entirely or partially. <P>COPYRIGHT: (C)2013,JPO&INPIT |
