| 摘要 |
<P>PROBLEM TO BE SOLVED: To shorten the work time by performing the movement and bonding of a lead wire to a circuit board continuously. <P>SOLUTION: The bonding device which bonds a lead wire, having a back surface abutting against a circuit board and a front surface on the side opposite to the back surface, to the circuit board at at least one joint of the back surface comprises a holding unit which holds the lead wire, a mobile unit which moves the holding unit between a first position where the lead wire is supplied and a second position where the lead wire is located at a bonding position on the circuit board, and a heating unit which heats a part of the lead wire corresponding to the joint. The holding unit has an air gap for exposing the lead wire at the part of the lead wire corresponding to the joint. <P>COPYRIGHT: (C)2013,JPO&INPIT |
